Multiple band direct conversion radio frequency transceiver integrated circuit

ABSTRACT

A multiple band direct conversion radio frequency (RF) transceiver integrated circuit (IC) includes a multiple band direct conversion transmitter section, a multiple band direct conversion receiver section, and a local oscillation module. The multiple band direct conversion transmitter section includes a transmit baseband module and a multiple frequency band transmission module. The multiple band direct conversion receiver section includes a multiple frequency band reception module and a receiver baseband module. The local oscillation generation module is operably coupled to generate a first frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the first mode and operably coupled to generate a second frequency band local oscillation when the multiple band direct conversion RF transceiver IC is in the second mode.

CROSS REFERENCE TO RELATED PATENTS

This invention is claiming priority under 35 USC §119(e) to aprovisionally filed patent application having the same title as thepresent patent application, a filing date of Mar. 29, 2005 and anapplication number of Ser. No. 60/666,125.

BACKGROUND OF THE INVENTION

1. Technical Field of the Invention

This invention relates generally to wireless communication systems andmore particularly to multiple frequency band wireless communications.

2. Description of Related Art

Communication systems are known to support wireless and wire linedcommunications between wireless and/or wire lined communication devices.Such communication systems range from national and/or internationalcellular telephone systems to the Internet to point-to-point in-homewireless networks. Each type of communication system is constructed, andhence operates, in accordance with one or more communication standards.For instance, wireless communication systems may operate in accordancewith one or more standards including, but not limited to, IEEE 802.11,Bluetooth, advanced mobile phone services (AMPS), digital AMPS, globalsystem for mobile communications (GSM), code division multiple access(CDMA), local multi-point distribution systems (LMDS),multi-channel-multi-point distribution systems (MMDS), and/or variationsthereof.

Depending on the type of wireless communication system, a wirelesscommunication device, such as a cellular telephone, two-way radio,personal digital assistant (PDA), personal computer (PC), laptopcomputer, home entertainment equipment, et cetera communicates directlyor indirectly with other wireless communication devices. For directcommunications (also known as point-to-point communications), theparticipating wireless communication devices tune their receivers andtransmitters to the same channel or channels (e.g., one of the pluralityof radio frequency (RF) carriers of the wireless communication system)and communicate over that channel(s). For indirect wirelesscommunications, each wireless communication device communicates directlywith an associated base station (e.g., for cellular services) and/or anassociated access point (e.g., for an in-home or in-building wirelessnetwork) via an assigned channel. To complete a communication connectionbetween the wireless communication devices, the associated base stationsand/or associated access points communicate with each other directly,via a system controller, via the public switch telephone network, viathe Internet, and/or via some other wide area network.

For each wireless communication device to participate in wirelesscommunications, it includes a built-in radio transceiver (i.e., receiverand transmitter) or is coupled to an associated radio transceiver (e.g.,a station for in-home and/or in-building wireless communicationnetworks, RF modem, etc.). As is known, the transmitter includes a datamodulation stage, one or more intermediate frequency stages, and a poweramplifier. The data modulation stage converts raw data into basebandsignals in accordance with a particular wireless communication standard.The one or more intermediate frequency stages mix the baseband signalswith one or more local oscillations to produce RF signals. The poweramplifier amplifies the RF signals prior to transmission via an antenna.

As is also known, the receiver is coupled to the antenna and includes alow noise amplifier, one or more intermediate frequency stages, afiltering stage, and a data recovery stage. The low noise amplifierreceives inbound RF signals via the antenna and amplifies then. The oneor more intermediate frequency stages mix the amplified RF signals withone or more local oscillations to convert the amplified RF signal intobaseband signals or intermediate frequency (IF) signals. The filteringstage filters the baseband signals or the IF signals to attenuateunwanted out of band signals to produce filtered signals. The datarecovery stage recovers raw data from the filtered signals in accordancewith the particular wireless communication standard.

For a wireless transceiver to operate in accordance with a particularwireless communication protocol, it must be designed to receive andtransmit radio frequency (RF) signals within a given carrier frequencyband using a particular baseband encoding, modulation, and/or scramblingprotocol. For instance, IEEE 802.11 a prescribes a frequency bands of5.15-5.25 GHz, 5.25-5.35 GHz, and 5.725-5.825 GHz, using a modulationscheme of binary phase shift keying (BPSK), quadrature phase shiftkeying (QPSK), sixteen quadrature amplitude modulation (16-QAM), orsixty-four quadrature amplitude modulation (64-QAM) and convolutionalcoding having a coding rate of ½, ⅔, or ¾. As another example, IEEE802.11b prescribes a frequency band of 2.400 to 2.483 GHz and modulatesthat wave using Direct Sequence Spread Spectrum (DSSS) or FrequencyHopping Spread Spectrum (FHSS). As yet another example, IEEE 802.11gprescribes a frequency band of 2.400 to 2.483 GHz using a modulationscheme of binary phase shift keying (BPSK), quadrature phase shiftkeying (QPSK), sixteen quadrature amplitude modulation (16-QAM), orsixty-four quadrature amplitude modulation (64-QAM).

From the above examples, for a wireless transceiver to operate inaccordance with IEEE 802.11a, it must be able to transmit and receive RFsignals in one of the 5 GHz frequency bands, while, to operate inaccordance with IEEE 802.11b, or g, the wireless transceiver must beable to transmit and receive RF signals in the 2.4 GHz frequency band.Because of the substantial difference in frequencies and the design ofthe transceiver, a wireless transceiver cannot effectively transmit RFsignals in the different 5 GHz frequency bands and/or in the 2.4 GHzfrequency band. Nevertheless, attempts have been made to integratedmultiple frequency band transceivers as described in “A Single-ChipDigitally Calibrated 5.15-5.825 GHz 0.18 μm CMOS Transceiver for 802.11aWireless LAN”, By Jason Vassiliou et, al. IEEE Journal of Solid-Statecircuits, Volume 38, No. 12, December 2003; and “A Single-Chip Dual-BandTri-Mode CMOS Transceiver for IEEE 802.11a/b/g WLAN”, by Masoud Zargari,et. al., ISSCC 2004/Session 5/WLAN Transceivers/5.4.

While the prior art is making advances in wireless transceivers, thereexists a need for an integrated multiple band direct conversion wirelesscommunication transceiver.

BRIEF SUMMARY OF THE INVENTION

The present invention is directed to apparatus and methods of operationthat are further described in the following Brief Description of theDrawings, the Detailed Description of the Invention, and the claims.Other features and advantages of the present invention will becomeapparent from the following detailed description of the invention madewith reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a schematic block diagram of a wireless communication systemin accordance with the present invention;

FIG. 2 is a schematic block diagram of a radio transceiver of a wirelesscommunication device in accordance with the present invention;

FIG. 3 is a frequency diagram of frequency bands in accordance with thepresent invention;

FIG. 4 is a schematic block diagram of a multiple frequency transmissionmodule in accordance with the present invention;

FIG. 5 is a schematic block diagram of a 1^(st) frequency or a 2^(nd)frequency band transmission module in accordance with the presentinvention;

FIG. 6 is a schematic block diagram of a multiple frequency bandreception module in accordance with the present invention;

FIG. 7 is a schematic block diagram of a 1^(st) or a 2^(nd) frequencyband reception module in accordance with the present invention;

FIG. 8 is a schematic block diagram of an alternate embodiment of amultiple frequency band transmission module in accordance with thepresent invention;

FIG. 9 is a schematic block diagram of another embodiment of a multiplefrequency band transmission module in accordance with the presentinvention;

FIG. 10 is a schematic block diagram of another embodiment of a multiplefrequency band reception module in accordance with the presentinvention;

FIG. 11 is a schematic block diagram of another embodiment of a multiplefrequency band reception module in accordance with the presentinvention;

FIG. 12 is a schematic block diagram of a receiver baseband module inaccordance with the present invention; and

FIG. 13 is a schematic block diagram of a multiple input multiple outputmultiple band radio transceiver in accordance with the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a schematic block diagram of a communication system 5that includes basic service set (BSS) areas 7 and 9, an independentbasic service set (IBSS) 11, and a network hardware device 15. Each ofthe BSS areas 7 and 9 include a base station and/or access point 17, 19and a plurality of wireless communication devices 21-23, 25-31. The IBSS11 includes a plurality of wireless communication devices 33-37. Each ofthe wireless communication devices 21-37 may be laptop host computers 21and 25, personal digital assistant hosts 23 and 29, personal computerhosts 31 and 33 and/or cellular telephone hosts 27 and 35.

The base stations or access points 17 and 19 are operably coupled to thenetwork hardware 15 via local area network connections 39 and 43. Thenetwork hardware 15, which may be a router, switch, bridge, modem,system controller, et cetera provides a wide area network connection 41for the communication system 5. Each of the base stations or accesspoints 17, 19 has an associated antenna or antenna array to communicatewith the wireless communication devices in its area. Typically, thewireless communication devices register with a particular base stationor access point 17, 19 to receive services from the communication system5. For direct connections (i.e., point-to-point communications) withinIBSS 11, wireless communication devices 33-37 communicate directly viaan allocated channel.

Typically, base stations are used for cellular telephone systems andlike-type systems, while access points are used for in-home orin-building wireless networks. Regardless of the particular type ofcommunication system, each wireless communication device includes abuilt-in radio transceiver and/or is coupled to a radio transceiver tofacilitate direct and/or in-direct wireless communications within thecommunication system 5. The radio transceiver, as will be described ingreater detail with reference to FIGS. 2-13.

FIG. 2 is a schematic block diagram of a multiple band MIMO (multipleinput multiple output) direct conversion radio frequency (RF)transceiver integrated circuit (IC) that includes a plurality ofmultiple band direct conversion transmit sections 10-1 through 10-n, aplurality of multiple band direct conversion receiver sections 12-1through 12-n, and a local generation module 22. Each of the multipleband direct conversion transmit sections 10-1 through 10-n includes atransmit baseband module 14 and a multiple frequency band transmissionmodule 16. Each of the multiple band direct conversion receiver sections12-1 through 12-n includes a receiver baseband module 18 and a multiplefrequency band reception module 20.

In operation, each of the multiple band direct conversion transmitsections 10-1 through 10-n may receive an outbound baseband signal 24-1through 24-n. The outbound baseband signal 24-1 through 24-n may be inaccordance with one or more wireless communication standards such asIEEE802.11a, b, g, n, and/or further extensions or variations thereof.In one embodiment, each of the multiple band direct conversion transmitsections 10-1 through 10-n are tuned to convert outbound basebandsignals 24-1 through 24-n into outbound RF signals with a 1^(st) or2^(nd) RF carrier 28-1 through 28-n. In addition, each of the multipleband direct conversion receiver sections 12-1 through 12-n are tuned toconverter inbound RF signals 34-1 through 34-n into processed inboundbaseband signals 38-1 through 38-n. In such an embodiment, the 1^(st) RFcarrier may be within the 2.4 GHz band (e.g., 2.400 GHz to 2.483) andthe 2^(nd) RF carrier maybe within one of the 5 GHz frequency bands(e.g., 5.15-5.25 GHz, 5.25-5.35 GHz, and 5.725-5.825 GHz).

For example, for a 4 by 4 MIMO wireless communication, the IC of FIG. 2would include 4 multiple band direct conversion transmit sections 10 and4 multiple band direct conversion receiver sections 12. A MIMO basebandprocessor (not shown) converts a stream of outbound data into aplurality of outbound baseband signals 24 and converts a plurality ofprocessed inbound baseband signals 38 into a stream of inbound data.Each of the multiple band direction conversion transmit sections 10 and12 are tuned to convert their respective outbound baseband signals 24into corresponding outbound RF signals having the 1^(st) or the 2^(nd)RF carrier 28. Similarly, each of the multiple band direct conversionreceiver sections 12 are tuned to convert their respective inbound RFsignals having the first or second RF carrier 34 into correspondingprocessed inbound baseband signals 38. The selection of the 1^(st) orthe 2^(nd) RF carrier frequency maybe based on which RF carrier willprovide a more efficient wireless communication (e.g., has lessinterference such that the data can be transmitted at a higher rate withless errors), a default protocol, user preference, capabilities ofdevices involved in the wireless communication, and/or systemrequirements.

As one of ordinary skill in the art will appreciate, the IC of FIG. 2may include any number of multiple band direct conversion transmitsections 10 and any number of multiple band direct conversion receiversections 12. In addition, any number in any combination of the multipleband direct conversion transmit sections 10 and multiple band directconversion receiver sections 12 may be active to facilitate a MIMOwireless communication. For example, if the IC includes M number ofmultiple band direct conversion transmit sections 10 and N number ofmultiple band direct conversion receiver sections 12, where M may or maynot equal N, the IC may support an M by N MIMO wireless communications.In addition, the IC may active less than M multiple band directconversion transmit sections 10 and/or may active less than N multipleband direct conversion receiver sections 12 to support m by n MIMOwireless communications, where m represents the number of the M multipleband direct conversion transmit sections 10 that are activated and nrepresents the number of the N multiple band direct conversion receiversections 12 that are activated.

As one of ordinary skill in the art will further appreciate, the IC mayinclude one multiple band direct conversion transmit section 10 and onemultiple band direction conversion receiver section 12 1 to providemultiple band direction conversion transceiver. In this instance, abaseband processing module (not shown) produces the outbound basebandsignals 24 from outbound data and produces inbound data from theprocessed inbound baseband signals 38 in accordance with a wirelesscommunication protocol (e.g., IEEE 802.11a, b, g). The multiple banddirect conversion transmit section 10 converts the outbound basebandsignals 24 in to outbound RF signals having the first or the second RFcarrier frequency 28, while the multiple band direct conversion receiversection 12 converts inbound RF signals having the first or the second RFcarrier frequency 34 into the processed inbound baseband signals 38.

Regardless of the numbers of the multiple band direct conversiontransmit and receiver sections 10 and 12 contained on the IC, each ofthe multiple band direct conversion transmit sections 10 operate in asimilar manner and each of the multiple band direct conversion receiversections 12 operate in a similar manner. For instance, to facilitate thebaseband to RF conversion within each of the multiple band directconversion transmit sections 10, the transmit baseband module 14processes the outbound baseband signals 24-x (where x represents 1through n) to produce processed outbound baseband signals 26. Theprocessing includes one or more of filtering, analog-to-digitalconversion, gain adjust and/or phase adjust of the outbound basebandsignals 24-x. Note that the outbound baseband signals 24-x may includean in-phase component and a quadrature component such that the processedoutbound baseband signals 26 include a processed in-phase component anda processed quadrature component.

Within each of the multiple band direct conversion transmit sections 10,the multiple frequency band transmission module 16 converts theprocessed outbound baseband signals 26 into outbound RF signals 28-xbased on a 1^(st) or 2^(nd) local oscillation 30, which is produced bylocal oscillation generation module 22. In one embodiment, the 1^(st)carrier frequency and the first local oscillation 30-1 will correspondto a frequency within the 2.4 GHz band. Accordingly, the multiplefrequency band transmission module 16 converts the processed outboundbaseband signals 26 into outbound RF signals having a 2.4 GHz RF carrierfrequency 28-x. Alternatively, the RF carrier frequency and the secondlocal oscillation 30-2 maybe within one of the 5 GHz frequency bands. Inthis instance, the LO generation module 22 generates a local oscillationwithin one of the 5 GHz bands such that the multiple frequency bandtransmission module 16 converts the processed outbound baseband signals26 into the outbound RF signals with a 5 GHz RF carrier 28-x.

Each of the multiple band direct conversion receiver sections 12-xreceives inbound RF signals with the 1^(st) or 2^(nd) RF carrier 34-xand, via the multiple frequency band reception module 20, converts theinbound RF signal into inbound baseband signals 36 in accordance withthe 1^(st) or 2^(nd) local oscillation 30. For example, the inbound RFsignals may have a carrier frequency in accordance with IEEE802.11a, orin accordance with IEEE802.11b or g. Depending on which wirelesscommunication standard is supported, the LO generation module 22generates the 1^(st) local oscillation to have a frequency correspondingto the 1^(st) RF carrier frequency (e.g., within the 2.4 GHz frequencyband) or the 2^(nd) local oscillation having a frequency correspondingto the 2^(nd) RF carrier (e.g., within one of the 5 GHz frequencybands).

The receiver baseband module 18 converts the inbound baseband signals 36into process inbound baseband signals 38-x. The processing may includeone or more of filtering, analog-to-digital conversion, gain adjust,phase adjust, and/or received signal strength measurements. The receiverbaseband module 18 will be described in greater detail with reference toFIG. 12.

FIG. 3 is a diagram of the frequency bands that may be used inaccordance with the present invention. As shown, a 1^(st) frequency band40 is separate from a 2^(nd) frequency band 42. In one embodiment, the1^(st) frequency band 40 may correspond with a 2.4 GHz frequency band(e.g., 2.400 GHz to 2.483 GHz) and the 2^(nd) frequency band 42 maycorrespond to one or more 5 GHz frequency bands (e.g., 5.15-5.25 GHz,5.25-5.35 GHz, and 5.725-5.825 GHz).

Within the 1^(st) frequency band 40, a 1^(st) RF carrier frequency 44may be positioned to correspond with a particular channel within the1^(st) frequency band 40, or may correspond to the center of thefrequency band 40. Similarly, a 2^(nd) RF carrier 45 is shown within the2^(nd) frequency band 42. The 2^(nd) RF carrier frequency 45 maycorrespond to a particular channel within the 2^(nd) frequency band 42and/or the center frequency of the frequency band. Note that the 1^(st)and/or 2^(nd) frequency band 40 and 42 may include a plurality offrequency bands, for example the 2^(nd) frequency band may include afrequency band from 5.15 GHz to 5.25 GHz, from 5.25 GHz to 5.35 GHz, andfrom 5.725 GHz to 5.825 GHz. Further note that the 1^(st) frequency band40 may be one of the 5.15 GHz to 5.25 GHz, from 5.25 GHz to 5.35 GHz,and from 5.725 GHz to 5.825 GHz frequency bands and the 2^(nd) frequencyband 42 may be another one of the 5.15 GHz to 5.25 GHz, from 5.25 GHz to5.35 GHz, and from 5.725 GHz to 5.825 GHz frequency bands. Still furthernote that the 1^(st) and 2^(nd) frequency bands 40 and 42 may includedifferent frequency bands than the ones listed in the preceding examplesas may be allocated for wireless communications by a controllinggovernmental entity.

FIG. 4 is a schematic block diagram of an embodiment of a multiplefrequency band transmission module 16 that includes a 1^(st) frequencyband transmission module 50, a 2^(nd) frequency band transmission module52 and a transmitter multiplexer 54. In operation, the process outboundbaseband signals 26 are provided to the transmit multiplexer 54. Basedon a 1^(st) or 2^(nd) mode signal 32, the multiplexer 54 provides theprocessed outbound baseband signals 26 to either the 1^(st) frequencybaseband transmission module 50 or to the 2^(nd) frequency basebandtransmission module 52. In one embodiment, the 1^(st) mode of modesignal 32 corresponds to transmitting the outbound RF signals having anRF carrier frequency within a 1^(st) frequency band 42 and the 2^(nd)mode of the mode signal 32 corresponds to transmitting the outbound RFsignals having an RF carrier frequency within the 2^(nd) frequency band42.

Accordingly, for the 1^(st) mode of the mode signal 32, the transmittermultiplexer 54 provides the processed outbound baseband signals 26 tothe 1^(st) frequency baseband transmission module 50. The 1^(st)frequency band transmission module 50, which will be described ingreater detail with reference to FIG. 5, converts the processed outboundbaseband signals 26 into outbound RF signals with the 1^(st) RF carrier28 a in accordance with the 1^(st) local oscillation 30-1. In oneembodiment, the 1^(st) RF carrier corresponds to a frequency within the1^(st) frequency band 40.

For the 2^(nd) mode of the mode signal 32, the transmitter multiplexer54 provides the processed outbound baseband signals 26 to the 2^(nd)frequency baseband transmission module 52. The 2^(nd) frequency basebandtransmission module 52, which will be described in greater detail withreference to FIG. 5, converts the processed outbound baseband signals 26into outbound RF signals with the 2^(nd) RF carrier 28-b in accordancewith the 2^(nd) local oscillation 30-2.

As one of average skill in the art will appreciate, the processedoutbound baseband signals 26 may have an in-phase component and aquadrature component. Accordingly, each of the 1^(st) and 2^(nd)frequency band transmission modules 50 and 52 produces the outbound RFsignals 28 a and 28 b from I and Q components of the processed outboundbaseband signals 26 in accordance with I and Q components of the 1^(st)or 2^(nd) local oscillations 30-1 or 30-2.

FIG. 5 is a schematic block diagram of an embodiment of the 1^(st) or2^(nd) frequency band transmission module 50 or 52 that includes amixing module 60 and a power amplifier driver 74. The mixing module 60includes a 1^(st) mixer 62, a 2^(nd) mixer 64, a 90° phase shift module66 and a summation module 68. The 1^(st) mixer 62 mixes an I component70 of the processed outbound baseband signals 26 with an in-phasecomponent of the local oscillation 30 to produce a 1^(st) mixed signal.The 2^(nd) mixer 64 mixes a quadrature component 72 of the processedoutbound baseband signals 26 with a 90° phase shifted representation ofthe local oscillation 30, which corresponds to a Q component, to producea 2^(nd) mixed signal. The summing module 68 sums the 1^(st) and 2^(nd)mixed signals to produce a summed mixed signal. The power amplifierdriver 74 amplifies the summed mixed signals to produce the outbound RFsignals 28 a or 28 b.

FIG. 6 is a schematic block diagram of an embodiment of a multiplefrequency band reception module 20 that includes a 1^(st) frequency bandreception module 80, a 2^(nd) frequency band reception module 82 and areceiver multiplexer 84. The 1^(st) frequency band reception module 80converts inbound RF signals having a 1^(st) carrier frequency 34 a intobaseband signals in accordance with the 1^(st) local oscillation 30-1.The 2^(nd) frequency baseband module 82 converts inbound RF signals withthe 2^(nd) RF carrier 34-b into baseband signals in accordance with the2^(nd) local oscillation 30-2. In one embodiment, the 1^(st) RF carrierand 1^(st) local oscillation 30-1 are in the 2.4 GHz frequency band andthe 2^(nd) RF carrier and 2^(nd) local oscillation 30-2 are in one ofthe 5 GHz frequency bands.

The receiver multiplexer 84 is operably coupled to output the basebandsignals 36 from the 1^(st) or 2^(nd) frequency band reception modules 80or 82 based on the 1^(st) or 2^(nd) mode signal 32 to produce theinbound baseband signal 36. In one embodiment, the 1^(st) mode of modesignal 32 corresponds to receiving the inbound RF signals having an RFcarrier frequency within a 1^(st) frequency band 42 and the 2^(nd) modeof the mode signal 32 corresponds to receiving the inbound RF signalshaving an RF carrier frequency within the 2^(nd) frequency band 42.

As one of average skill in the art will appreciate, the inbound basebandsignals 36 may have an in-phase component and a quadrature component.Accordingly, each of the 1^(st) and 2^(nd) frequency band transmissionmodules 80 and 82 produces I and Q components of the inbound basebandsignals 36 from the inbound RF signals 34A or 34B in accordance with Iand Q components of the 1^(st) or 2^(nd) local oscillations 30-1 or30-2.

FIG. 7 is a schematic block diagram of an embodiment of the 1^(st)and/or 2^(nd) frequency band reception modules 80 or 82. The module 80or 82 includes a mixing module 92 and a low noise amplifier 90. Themixing module 92 includes a 1^(st) mixer 94, a 2^(nd) mixer 96, and a90° phase shift module 98.

The low noise amplifier 90 receives the inbound RF signals having the1^(st) or 2^(nd) carrier frequency 34-a or 34-b and amplifies it toproduce an amplified inbound RF signal 102. The mixing module 92receives the amplified inbound signal 102 via the 1^(st) mixing module94 and the 2^(nd) 90° phase shift module 100. The 1st mixing module 94mixes the amplified inbound RF signal 102 with an in-phase component ofthe local oscillation 30 to produce an I component 104 of the inboundbaseband signal 36.

The second mixer 96 mixes the amplified inbound RF signal 102 with a 90°phase shifted representation of the local oscillation to produce a Qcomponent 106 of the inbound baseband signals 36.

FIG. 8 is a schematic block diagram of another embodiment of themultiple frequency baseband transmit module 16. In this embodiment,module 16 includes a mixing module 110, a 1^(st) multiplexer 112, a2^(nd) multiplexer 144, a 1^(st) power amplifier driver module 116 and a2^(nd) power amplifier driver module 118. The mixing module 110 receivesthe processed outbound baseband signals 26 and the 1^(st) or 2^(nd) modecontrol signal 32. Multiplexer 112 receives the 1st and 2^(nd) localoscillations 30-1 and 30-2 and the 1^(st) or 2^(nd) mode control signal32. When the integrated circuit is in a 1^(st) mode, the mixing module110 is tuned to mix the outbound baseband signals 26 with the 1^(st)local oscillation 30-1. When the integrated circuit is in the 2^(nd)mode, the mixing module 110 is tuned to mix the 2^(nd) local oscillation30-2 with the processed outbound baseband signals 26. The tuning ofmixing module 110 includes, but is not limited to, adjusting theinductors within the mixers of the mixing module 110. For example,mixing module 110 may be similar to mixing module 60 of FIG. 5 wheremixers 62 and 64 are adjustable based on the corresponding mode signal32. In addition, the 90° phase shift module of 66, if used within mixingmodule 110, may also be tuned to the particular local oscillation beingused.

The multiplexer 144 provides the output of mixing module 110 to eitherthe 1^(st) power amplifier driver 116 or the 2^(nd) power amplifierdriver 118 based on the mode signal 32. The 1^(st) power amplifierdriver 116 is tuned to amplify signals having the 1^(st) carrierfrequency to produce the RF outbound signals 28 a while the 2^(nd) poweramplifier driver module 118 is tuned to amplify the outbound RF signalshaving the 2^(nd) carrier frequency 28 b.

As one of average skill in the art will appreciate, the processedoutbound baseband signals 26 may have an in-phase component and aquadrature component. Accordingly, the multiple frequency bandtransmission module 16 produces the outbound RF signals 28 a and 28 bfrom I and Q components of the processed outbound baseband signals 26 inaccordance with I and Q components of the 1^(st) or 2^(nd) localoscillations 30-1 or 30-2.

FIG. 9 is another embodiment of the multiple frequency band transmissionmodule 16 that includes the mixing module 110 and a band tunable, oradjustable, power amplifier driver module 120. In this embodiment,mixing module 110 and multiplexer 112 operate as previously describedwith reference to FIG. 8. In this embodiment, the band tunable poweramplifier driver 120 is adjusted based on the 1^(st) or 2^(nd) modecontrol signal 32 to produce the outbound RF signals having the 1^(st)or 2^(nd) carrier frequency 28 a or 28 b.

As one of average skill in the art will appreciate, the processedoutbound baseband signals 26 may have an in-phase component and aquadrature component. Accordingly, the multiple frequency bandtransmission module 16 produces the outbound RF signals 28 a and 28 bfrom I and Q components of the processed outbound baseband signals 26 inaccordance with I and Q. components of the 1^(st) or 2^(nd) localoscillations 30-1 or 30-2.

FIG. 10 is a schematic block diagram of another embodiment of themultiple frequency band reception module 20. In this embodiment, themodule 20 includes a 1^(st) low noise amplifier 130, a 2^(nd) low noiseamplifier 132, a multiplexer 134, a mixing module 136 and a multiplexer138. In a 1^(st) mode of operation, the 1^(st) low noise amplifier 130receives inbound RF signals having a 1^(st) carrier frequency 34 a andamplifies them to produce inbound amplified RF signals 140. Multiplexer134, in accordance with a first mode of the 1^(st) or 2^(nd) modecontrol signal 32, passes the 1^(st) amplified RF signals 140 to themixing module 136. In addition, multiplexer 138 provides the 1^(st)local oscillation 30-1 to the mixing module 136 in accordance with thefirst mode of the 1^(st) or 2^(nd) mode control signal 32. The mixingmodule 136 mixes the 1^(st) amplified RF signals 140 with the 1^(st)local oscillation 30-1 to produce the inbound baseband signal 36. Inthis embodiment, the mixing module 136 may be tuned in accordance withthe first mode of the 1^(st) or 2^(nd) mode signal 32.

In a 2^(nd) mode of operation, the 2^(nd) low noise amplifier 132receives the inbound RF signals having the 2^(nd) carrier frequency 34 band amplifies them to produce 2^(nd) amplified RF signals 142. Inaccordance with the second mode of the 1^(st) or 2^(nd) mode controlsignal 32, multiplexer 134 provides the 2^(nd) amplified RF signals 142to the mixing module 136 and multiplexer 138 provides the 2^(nd) localoscillation 32 to mixing module 136. The mixing module 136 is tuned inaccordance with the 1^(st) or 2^(nd) control signal 32 and mixes the2^(nd) amplified RF signal 142 with the 2^(nd) local oscillation 30-2 toproduce the inbound baseband signals 36.

As one of ordinary skill in the art will appreciate, the mixing module136 may include similar components to mixing module 92 of FIG. 7 wherethe 1^(st) mixing module and 2^(nd) mixing module 94 and 96 would beadjustable based on the corresponding frequencies of operation. Inaddition, the 1^(st) and 2^(nd) 90° phase shift modules 98 and 100 mayalso be adjustable based on the particular frequencies of operation. Asone of average skill in the art will further appreciate, the inboundbaseband signals 36 may have an in-phase component and a quadraturecomponent. Accordingly, multiple frequency band reception module 20produces I and Q components of the inbound baseband signals 36 from theinbound RF signals 34A or 34B in accordance with I and Q components ofthe 1^(st) or 2^(nd) local oscillations 30-1 or 30-2.

FIG. 11 is a schematic block diagram of another embodiment of themultiple frequency band reception module 20. In this embodiment, module20 includes the mixing module 136, the multiplexer 138, and a bandtunable low noise amplifier 150. The mixing module 136 and multiplexer138 operate as previously described with reference to FIG. 10.

The band tunable, or adjustable, LNA 150, in accordance with the 1^(st)or 2^(nd) mode control signal 32, receives the inbound RF signal havingthe 1^(st) or 2^(nd) carrier frequency 34 a or 34 b and produces therefrom amplified inbound RF signals. When the control signal 32 indicatesthe 1^(st) mode of operation, the low noise amplifier 150 is tuned tothe frequency corresponding to the 1^(st) carrier frequency. Inaddition, the adjustable LNA 150 receives the inbound RF signals havingthe 1^(st) carrier frequency 34 to produce the amplified inbound RFsignals.

In the 2^(nd) mode, the adjustable LNA 150 is adjusted to frequenciescorresponding to the 2^(nd) RF carrier frequency such that it mayreceive and amplify the inbound RF signals having the 2^(nd) carrierfrequency 34 b. As one of average skill in the art will appreciate, theinbound baseband signals 36 may have an in-phase component and aquadrature component. Accordingly, multiple frequency band receptionmodule 20 produces I and Q components of the inbound baseband signals 36from the inbound RF signals 34A or 34B in accordance with I and Qcomponents of the 1^(st) or 2^(nd) local oscillations 30-1 or 30-2.

As one of ordinary skill in the art will appreciate the multiplexers ofFIGS. 8-11 may be of any construct including a current multiplexer, avoltage multiplexer, switching network, direction connection with theselective path enabled and the non-selected path disabled and/or anyother means for switching and/or selecting a signal path.

FIG. 12 is a schematic block diagram of an embodiment of the receiverbaseband module 18. In this embodiment, module 18 includes a 1^(st)variable gain amplifier module 160, a low pass filter module 162, a2^(nd) variable gain module 164 and a driver module 166. Each of thevariable gain modules 160 and 164 has its gain set based on themagnitude of the inbound signals to produce a desired level for theprocess inbound baseband signal 38. In addition, each of the outputs ofmodules 160, 162 and 164 may be used for RSSI (received signal strengthindication) measurements.

FIG. 13 is a schematic block diagram of a 2×2 MIMO transceiverintegrated circuit. The MIMO transceiver includes a baseband processingmodule 178, a plurality of transmit/receive switches 170-176, a pair ofmultiple band direct conversion transmit sections 10 and a pair ofmultiple band direct conversion receive sections 12. The multiple banddirect conversion transmit section includes the 1^(st) and 2^(nd)frequency band transmission modules 50 and 52, transmit multiplexer 54and transmit baseband module 14. Each of the multiple band directconversion receiver sections include the 1^(st) and 2^(nd) frequencyband reception modules 80 and 82, the receiver multiplexer 84 and thereceiver baseband module 18.

In operation, when the 2×2 MIMO transceiver is to transmit data, thebaseband processing module 178 processes outbound data and provides aportion of it to the baseband processing modules 14. Each of thebaseband processing modules 14 processes their portion of the outputdata to produce the processed outbound baseband signals 26, which areprovided to the corresponding multiplexers 54. When the device is in the1^(st) mode, the 1^(st) frequency band transmit sections 50 areactivated to convert the corresponding processed outbound basebandsignals 26 into the outbound RF signals having the first RF carrierfrequency, which are provided to transmit/receive switch 170 and 174,respectively, for a MIMO transmission. When the device is in the 2^(nd)mode, the 2^(nd) frequency band transmissions modules 52 are active toconvert the processed outbound baseband signals into the RF signalshaving the second RF carrier frequency, which are provided to the RFsignals to transmit receive sections 172 and 176 for a MIMOtransmission.

For reception of a MIMO signal, where the device is in a 1^(st) mode,the 1^(st) frequency reception modules 80 receive the inbound RF signalshaving the first RF carrier frequency via transmit/receive switches 172and 174. The 1^(st) frequency band reception modules 80 convert theinbound RF signals into the inbound baseband signals and provide them tomultiplexers 84. Multiplexers 84 provide the inbound baseband signals tothe receiver baseband processing modules 18, which produce the processedinbound baseband signals. The receiver baseband processing modules 18provide the processed inbound baseband signals to the basebandprocessing module 178, which produces the inbound data from the twostreams of processed inbound baseband signals.

In the 2^(nd) mode of operation, the 2^(nd) frequency band receivermodules 82 receive the inbound RF signals having the second RF carrierfrequency via transmit/receive switches 170 and 176, respectfully. The2^(nd) frequency band reception modules 82 convert the inbound RFsignals into the inbound baseband signals and provide them tomultiplexers 84. Multiplexers 84 provides the inbound baseband signalsto the receiver baseband processing modules 18, which produce theprocessed inbound baseband signals. The receiver baseband processingmodules 18 provide the processed inbound baseband signals to thebaseband processing module 178, which produces the inbound data from thetwo streams of processed inbound baseband signals.

As one of ordinary skill in the art will appreciate, the RF transceiverof FIG. 13, which includes modules 14, 18, 54, 84, 80, 82, 50 and 52,may be implemented on one integrated circuit, may be implemented on twointegrated circuits, or may be included on four integrated circuits asindicated by the dashed lines.

As one of ordinary skill in the art will appreciate, the term“substantially” or “approximately”, as may be used herein, provides anindustry-accepted tolerance to its corresponding term and/or relativitybetween items. Such an industry-accepted tolerance ranges from less thanone percent to twenty percent and corresponds to, but is not limited to,component values, integrated circuit process variations, temperaturevariations, rise and fall times, and/or thermal noise. Such relativitybetween items ranges from a difference of a few percent to magnitudedifferences. As one of ordinary skill in the art will furtherappreciate, the term “operably coupled”, as may be used herein, includesdirect coupling and indirect coupling via another component, element,circuit, or module where, for indirect coupling, the interveningcomponent, element, circuit, or module does not modify the informationof a signal but may adjust its current level, voltage level, and/orpower level. As one of ordinary skill in the art will also appreciate,inferred coupling (i.e., where one element is coupled to another elementby inference) includes direct and indirect coupling between two elementsin the same manner as “operably coupled”. As one of ordinary skill inthe art will further appreciate, the term “compares favorably”, as maybe used herein, indicates that a comparison between two or moreelements, items, signals, etc., provides a desired relationship. Forexample, when the desired relationship is that signal 1 has a greatermagnitude than signal 2, a favorable comparison may be achieved when themagnitude of signal 1 is greater than that of signal 2 or when themagnitude of signal 2 is less than that of signal 1.

The preceding discussion has presented a multi-band direct conversiontransceiver, receiver and/or transmitter. As one of average skill in theart will appreciate, other embodiments may be derived from the teachingsof the present invention without deviating from the scope of the claims.

1. A multiple band direct conversion radio frequency (RF) transceiverintegrated circuit (IC) comprises: a multiple band direct conversiontransmitter section including: transmit baseband module operably coupledto receive an outbound baseband signal, wherein the transmit basebandmodule performs at least one of filtering, analog to digital conversion,gain adjust, and phase adjust on the outbound baseband signal to producea processed outbound baseband signal; and a multiple frequency bandtransmission module operably coupled to convert the processed outboundbaseband signal into an outbound RF signal having a first RF carrierfrequency within a first frequency band into in accordance with a firstband local oscillation when the multiple band direct conversion RFtransceiver IC is in a first mode and operably coupled to convert theprocessed outbound baseband signal into an outbound RF signal having asecond RF carrier frequency within a second frequency band in accordancewith a second band local oscillation when the multiple band directconversion RF transceiver IC is in a second mode; a multiple band directconversion receiver section including: a multiple frequency bandreception module operably coupled to convert an inbound RF signal havingthe first RF carrier frequency into an inbound baseband signal inaccordance with the first band local oscillation when the multiple banddirect conversion RF transceiver IC is in the first mode and operablycoupled to convert an inbound RF signal having the second RF carrierfrequency into the inbound baseband signal in accordance with the secondband local oscillation when the multiple band direct conversion RFtransceiver IC is in the second mode; and a receiver baseband moduleoperably coupled to receive the inbound baseband signal, wherein thereceiver baseband module performs at least one of filtering, analog todigital conversion, gain adjust, phase adjust, and received signalstrength measurement on the inbound baseband signal to produce aprocessed inbound baseband signal; and a local oscillation generationmodule operably coupled to generate the first frequency band localoscillation when the multiple band direct conversion RF transceiver ICis in the first mode and operably coupled to generate the secondfrequency band local oscillation when the multiple band directconversion RF transceiver IC is in the second mode, wherein selection ofthe first mode or the second mode is based upon wireless communicationefficiency.
 2. The multiple band direct conversion RF transceiver IC ofclaim 1, wherein the multiple frequency band transmission modulecomprises: a first frequency band transmission module operably coupledto convert the processed outbound baseband signal into the outbound RFsignal having the first RF carrier frequency in accordance with thefirst band local oscillation; a second frequency band transmissionmodule operably coupled to convert the processed outbound basebandsignal into the outbound RF signal having the second RF carrierfrequency in accordance with the second band local oscillation; and atransmitter multiplexer operably coupled to provide the processedoutbound baseband signal to the first frequency band transmission modulewhen the multiple band direct conversion RF transceiver IC is in thefirst mode and operably coupled to provide the processed outboundbaseband signal to the first frequency band transmission module when themultiple band direct conversion RF transceiver IC is in the second mode.3. The multiple band direct conversion RF transceiver IC of claim 2,wherein each of the first and second frequency band transmission modulescomprises: a mixing module operably coupled to mix the processedoutbound baseband signal with the first or second band local oscillationto produce a mixed signal; and a power amplifier driver module operablycoupled to amplify the mixed signal to produce the outbound RF signalhaving the first or second RF carrier frequency.
 4. The multiple banddirect conversion RF transceiver IC of claim 1, wherein the multiplefrequency band reception module comprises: a first frequency bandreception module operably coupled to convert the inbound RF signalhaving the first RF carrier frequency into the inbound baseband signalin accordance with the first band local oscillation; a second frequencyband reception module operably coupled to convert the inbound RF signalhaving the second RF carrier frequency into the inbound baseband signalin accordance with the second band local oscillation; and a receivermultiplexer operably coupled to provide the inbound baseband signal fromthe first frequency band reception module to the receiver basebandmodule when the multiple band direct conversion RF transceiver IC is inthe first mode and operably coupled to provide the inbound basebandsignal from the second frequency band reception module to the receiverbaseband module when the multiple band direct conversion RF transceiverIC is in the second mode.
 5. The multiple band direct conversion RFtransceiver IC of claim 4, wherein each of the first and secondfrequency band reception modules comprises: a low noise amplifieroperably coupled to amplify the inbound RF signal having the first orsecond RF carrier frequency into an amplified inbound RF signal; and amixing module operably coupled to mix the amplified inbound RF signalwith the first or second band local oscillation to produce the inboundbaseband signal.
 6. The multiple band direct conversion RF transceiverIC of claim 1, wherein the multiple frequency band transmission modulecomprises: a mixing module operably coupled to mix the processedoutbound baseband signal with the first band local oscillation when themultiple band direct conversion RF transceiver IC is in the first modeto produce a first mixed signal and to mix the processed outboundbaseband signal with the second band local oscillation when the multipleband direct conversion RF transceiver IC is in the second mode toproduce a second mixed signal; first multiplexer operably coupled toprovide the first or second band local oscillation to the mixing modulein accordance with the multiple band direct conversion RF transceiver ICbeing in the first or second mode, respectively; a first power amplifierdriver module operably coupled to amplify the first mixed signal toprovide the outbound RF signal having the first RF carrier frequency; asecond power amplifier driver module operably coupled to amplify thesecond mixed signal to provide the outbound RF signal having the secondRF carrier frequency; and a second multiplexer operably coupled toprovide the first mixed signal to the first power amplifier drivermodule when the multiple band direct conversion RF transceiver IC is inthe first mode and to provide the second mixed signal to the secondpower amplifier driver module when the multiple band direct conversionRF transceiver IC is in the second mode.
 7. The multiple band directconversion RF transceiver IC of claim 1, wherein the multiple frequencyband transmission module comprises: a mixing module operably coupled tomix the processed outbound baseband signal with the first band localoscillation when the multiple band direct conversion RF transceiver ICis in the first mode to produce a first mixed signal and to mix theprocessed outbound baseband signal with the second band localoscillation when the multiple band direct conversion RF transceiver ICis in the second mode to produce a second mixed signal; firstmultiplexer operably coupled to provide the first or second band localoscillation to the mixing module in accordance with the multiple banddirect conversion RF transceiver IC being in the first or second mode,respectively; and an adjustable power amplifier driver module operablycoupled to amplify the first mixed signal to provide the outbound RFsignal having the RF carrier frequency within the first frequency bandwhen the multiple band direct conversion RF transceiver IC is in thefirst mode and operably coupled to amplify the second mixed signal toprovide the outbound RF signal having the RF carrier frequency withinthe second frequency band when the multiple band direct conversion RFtransceiver IC is in the second mode.
 8. The multiple band directconversion RF transceiver IC of claim 1, wherein the multiple frequencyband reception module comprises: a first low noise amplifier operablycoupled to amplify the inbound RF signal having the first RF carrierfrequency to produce a first amplified inbound RF signal; a second lownoise amplifier operably coupled to amplify the inbound RF signal havingthe second RF carrier frequency to produce a second amplified inbound RFsignal; a mixing module; a first multiplexer operably coupled to providethe first amplified inbound RF signal to the mixing module when themultiple band direct conversion RF transceiver IC is in the first modeand to provide the second amplified inbound RF signal to the mixingmodule when the multiple band direct conversion RF transceiver IC is inthe second mode; and a second multiplexer operably coupled to providethe first band local oscillation to the mixing module when the multipleband direct conversion RF transceiver IC is in the first mode and toprovide the second band local oscillation to the mixing module when themultiple band direct conversion RF transceiver IC is in the second mode,wherein the mixing module mixes the first band local oscillation and thefirst amplified inbound RF signal or mixes the second band localoscillation and the second amplified inbound RF signal to produce theinbound baseband signal.
 9. The multiple band direct conversion RFtransceiver IC of claim 1, wherein the multiple frequency band receptionmodule comprises: an adjustable low noise amplifier operably coupled toamplify the inbound RF signal having the first RF carrier frequency toproduce a first amplified inbound RF signal and operably coupled toamplify the inbound RF signal having the second RF carrier frequency toproduce a second amplified inbound RF signal; a mixing module; and amultiplexer operably coupled to provide the first band local oscillationto the mixing module when the multiple band direct conversion RFtransceiver IC is in the first mode and to provide the second band localoscillation to the mixing module when the multiple band directconversion RF transceiver IC is in the second mode, wherein the mixingmodule mixes the first band local oscillation and the first amplifiedinbound RF signal or mixes the second band local oscillation and thesecond amplified inbound RF signal to produce the inbound basebandsignal.
 10. The multiple band direct conversion RF transceiver IC ofclaim 1, wherein the receiver baseband module comprises: a firstvariable gain amplifier module operably coupled to amplify the inboundbaseband signal in accordance with a first gain setting to produceamplified inbound baseband signal; a low pass filter module operablycoupled to low pass filter the amplified inbound baseband signal toproduce filtered inbound baseband signal; a second variable gainamplifier module operably coupled to amplify the filtered inboundbaseband signal in accordance with a second gain setting to producesecond amplified baseband signal; and a driver module operably coupledto drive the second amplified baseband signal to produce the processedinbound baseband signal.
 11. A multiple band direct conversion radiofrequency (RF) transmitter integrated circuit (IC) comprises: a transmitbaseband module operably coupled to receive an outbound in-phasebaseband signal component and an outbound quadrature baseband signalcomponent of an outbound baseband signal, wherein the transmit basebandmodule performs at least one of filtering, analog to digital conversion,gain adjust, and phase adjust on the outbound in-phase signal componentand the outbound quadrature signal component to produce a basebandprocessed outbound in-phase baseband signal component and a processedquadrature baseband signal component; a multiple frequency bandtransmission module operably coupled to convert the processed outboundin-phase baseband signal component and the processed quadrature basebandsignal component into an outbound RF signal having a first RF carrierfrequency within a first frequency band in accordance with a first bandlocal oscillation when the multiple band direct conversion RFtransmitter IC is in a first mode and operably coupled to convert theprocessed outbound in-phase baseband signal component and the processedquadrature baseband signal component into an outbound RF signal having asecond RF carrier frequency within a second frequency band in accordancewith a second band local oscillation when the multiple band directconversion RF transmitter IC is in a second mode; and a localoscillation generation module operably coupled to generate the firstfrequency band local oscillation when the multiple band directconversion RF transmitter IC is in the first mode and operably coupledto generate the second frequency band local oscillation when themultiple band direct conversion RF transmitter IC is in the second mode,wherein selection of the first mode or the second mode is based uponwireless communication efficiency.
 12. The multiple band directconversion RF transmitter IC of claim 11, wherein the multiple frequencyband transmission module comprises: a first frequency band transmissionmodule operably coupled to convert the processed outbound in-phasebaseband signal component and the processed quadrature baseband signalcomponent into the outbound RF signal having the first RF carrierfrequency in accordance with the first band local oscillation; a secondfrequency band transmission module operably coupled to convert theprocessed outbound in-phase baseband signal component and the processedquadrature baseband signal component into the outbound RF signal havingthe second RF carrier frequency in accordance with the second band localoscillation; and a transmitter multiplexer operably coupled to providethe baseband processed in-phase signal component and baseband processedquadrature signal component to the first frequency band transmissionmodule when the multiple band direct conversion RF transmitter IC is inthe first mode and operably coupled to provide the baseband processedin-phase signal component and baseband processed quadrature signalcomponent to the first frequency band transmission module when themultiple band direct conversion RF transmitter IC is in the second mode.13. The multiple band direct conversion RF transmitter IC of claim 12,wherein each of the first and second frequency band transmission modulescomprises: a mixing module operably coupled to mix the processedoutbound in-phase baseband signal component and the processed quadraturebaseband signal component with the first or second band localoscillation to produce a mixed signal; and a power amplifier drivermodule operably coupled to amplify the mixed signal to produce theoutbound RF signal having the first or second RF carrier frequency. 14.The multiple band direct conversion RF transmitter IC of claim 11,wherein the multiple frequency band transmission module comprises: amixing module operably coupled to mix the processed outbound in-phasebaseband signal component and the processed quadrature baseband signalcomponent with the first band local oscillation when the multiple banddirect conversion RF transmitter IC is in the first mode to producefirst mixed in-phase and quadrature signal components and to mix theprocessed outbound in-phase baseband signal component and the processedquadrature baseband signal component with the second band localoscillation when the multiple band direct conversion RF transmitter ICis in the second mode to produce second mixed in-phase and quadraturesignal components; first multiplexer operably coupled to provide thefirst or second band local oscillation to the mixing module inaccordance with the multiple band direct conversion RF transmitter ICbeing in the first or second mode, respectively; a first power amplifierdriver module operably coupled to amplify the first mixed in-phase andquadrature signal components to provide the outbound RF signal havingthe first RF carrier frequency; a second power amplifier driver moduleoperably coupled to amplify the second mixed in-phase and quadraturesignal components to provide the outbound RF signal having the second RFcarrier frequency; and a second multiplexer operably coupled to providethe first mixed in-phase and quadrature signal components to the firstpower amplifier driver module when the multiple band direct conversionRF transmitter IC is in the first mode and to provide the second mixedin-phase and quadrature signal components to the second power amplifierdriver module when the multiple band direct conversion RF transmitter ICis in the second mode.
 15. The multiple band direct conversion RFtransmitter of claim 11, wherein the multiple frequency bandtransmission module comprises: a mixing module operably coupled to mixthe processed outbound in-phase baseband signal component and theprocessed quadrature baseband signal component with the first band localoscillation when the multiple band direct conversion RF transmitter ICis in the first mode to produce first mixed in-phase and quadraturesignal components and to mix the processed outbound in-phase basebandsignal component and the processed quadrature baseband signal componentwith the second band local oscillation when the multiple band directconversion RF transmitter IC is in the second mode to produce secondmixed in-phase and quadrature signal components; first multiplexeroperably coupled to provide the first or second band local oscillationto the mixing module in accordance with the multiple band directconversion RF transmitter IC being in the first or second mode,respectively; and an adjustable power amplifier driver module operablycoupled to amplify the first mixed in-phase and quadrature signalcomponents to provide the outbound RF signal having the first RF carrierfrequency when the multiple band direct conversion RF transmitter IC isin the first mode and operably coupled to amplify the second mixedin-phase and quadrature signal components to provide the outbound RFsignal having the second RF carrier frequency when the multiple banddirect conversion RF transmitter IC is in the second mode.
 16. Amultiple band direct conversion radio frequency (RF) receiver integratedcircuit (IC) comprises: a multiple frequency band reception moduleoperably coupled to convert an inbound RF signal having a first RFcarrier frequency within a first frequency band into an inbound in-phasebaseband signal component and an inbound quadrature baseband signalcomponent in accordance with a first band local oscillation when themultiple band direct conversion RF receiver IC is in a first mode andoperably coupled to convert an inbound RF signal having a second RFcarrier frequency within a second frequency band into the inboundin-phase baseband signal component and the inbound quadrature basebandsignal component in accordance with a second band local oscillation whenthe multiple band direct conversion RF receiver IC is in a second mode;a receiver baseband module operably coupled to receive the inboundin-phase baseband signal component and the inbound quadrature basebandsignal component, wherein the receiver baseband module performs at leastone of filtering, analog to digital conversion, gain adjust, phaseadjust, and received signal strength measurement on the inbound in-phasebaseband signal component and the inbound quadrature baseband signalcomponent to produce a processed inbound in-phase baseband signalcomponent and a processed inbound quadrature baseband signal component;and a local oscillation generation module operably coupled to generatethe first frequency band local oscillation when the multiple band directconversion RF receiver IC is in the first mode and operably coupled togenerate the second frequency band local oscillation when the multipleband direct conversion RF receiver IC is in the second mode, whereinselection of the first mode or the second mode is based upon wirelesscommunication efficiency.
 17. The multiple band direct conversion RFreceiver IC of claim 16, wherein the multiple frequency band receptionmodule comprises: a first frequency band reception module operablycoupled to convert the inbound RF signal having the first RF carrierfrequency into the inbound in-phase baseband signal component and theinbound quadrature baseband signal component in accordance with thefirst band local oscillation; and a second frequency band receptionmodule operably coupled to convert the inbound RF signal having thesecond RF carrier frequency into the inbound in-phase baseband signalcomponent and the inbound quadrature baseband signal component inaccordance with the second band local oscillation; and a receivermultiplexer operably coupled to provide the inbound in-phase basebandsignal component and the inbound quadrature baseband signal componentfrom the first frequency band reception module to the receiver basebandmodule when the multiple band direct conversion RF receiver IC is in thefirst mode and operably coupled to provide the inbound in-phase basebandsignal component and the inbound quadrature baseband signal componentfrom the second frequency band reception module to the receiver basebandmodule when the multiple band direct conversion RF receiver IC is in thesecond mode.
 18. The multiple band direct conversion RF receiver IC ofclaim 17, wherein each of the first and second frequency band receptionmodules comprises: a low noise amplifier operably coupled to amplify theinbound RF signal having the first or second RF carrier frequency intoan amplified inbound RF signal; and a mixing module operably coupled tomix the amplified inbound RF signal with the first or second band localoscillation to produce the inbound in-phase baseband signal componentand the inbound quadrature baseband signal component.
 19. The multipleband direct conversion RF receiver IC of claim 16, wherein the multiplefrequency band reception module comprises: a first low noise amplifieroperably coupled to amplify the inbound RF signal having the first RFcarrier frequency to produce a first amplified inbound RF signal; asecond low noise amplifier operably coupled to amplify the inbound RFsignal having the second RF carrier frequency to produce a secondamplified inbound RF signal; a mixing module; a first multiplexeroperably coupled to provide the first amplified inbound RF signal to themixing module when the multiple band direct conversion RF receiver IC isin the first mode and to provide the second amplified inbound RF signalto the mixing module when the multiple band direct conversion RFreceiver IC is in the second mode; and a second multiplexer operablycoupled to provide the first band local oscillation to the mixing modulewhen the multiple band direct conversion RF receiver IC is in the firstmode and to provide the second band local oscillation to the mixingmodule when the multiple band direct conversion RF receiver IC is in thesecond mode, wherein the mixing module mixes the first band localoscillation and the first amplified inbound RF signal or mixes thesecond band local oscillation and the second amplified inbound RF signalto produce the inbound in-phase baseband signal component and theinbound quadrature baseband signal component.
 20. The multiple banddirect conversion RF receiver IC of claim 16, wherein the multiplefrequency band reception module comprises: an adjustable low noiseamplifier operably coupled to amplify the inbound RF signal having thefirst RF carrier frequency to produce a first amplified inbound RFsignal and operably coupled to amplify the inbound RF signal having thesecond RF carrier frequency to produce a second amplified inbound RFsignal; a mixing module; and a multiplexer operably coupled to providethe first band local oscillation to the mixing module when the multipleband direct conversion RF receiver IC is in the first mode and toprovide the second band local oscillation to the mixing module when themultiple band direct conversion RF receiver IC is in the second mode,wherein the mixing module mixes the first band local oscillation and thefirst amplified inbound RF signal or mixes the second band localoscillation and the second amplified inbound RF signal to produce theinbound in-phase baseband signal component and the inbound quadraturebaseband signal component.
 21. The multiple band direct conversion RFreceiver IC of claim 16, wherein the receiver baseband module comprises:a first variable gain amplifier module operably coupled to amplify theinbound in-phase baseband signal component and the inbound quadraturebaseband signal component in accordance with a first gain setting toproduce amplified inbound in-phase quadrature baseband signalcomponents; a low pass filter module operably coupled to low pass filterthe amplified inbound in-phase and quadrature baseband signal componentsto produce filtered inbound in-phase and quadrature baseband signalcomponents; a second variable gain amplifier module operably coupled toamplify the filtered inbound in-phase and quadrature baseband signalcomponents in accordance with a second gain setting to produce secondamplified inbound in-phase and quadrature baseband signal components;and a driver module operably coupled to drive the second amplifiedinbound in-phase and quadrature baseband signal components to producethe processed inbound in-phase baseband signal component and theprocessed inbound quadrature baseband signal component.